Справочник Пользователя для Intel E8501
NB Reference Thermal Solution #1
26
Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6.5
First NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners.
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners.
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
contains vendor information for each thermal solution component.
NOTE: All dimensions are in millimeters.
Figure 6-3. First NB Heatsink Board Component Keepout
TNB Location
4X Ø 2.95 ± 0.0254mm
64.500mm.
55.245mm.
64.500mm.
55.245mm.
No Component Keep Out Area
4.14mm Max Component Height
4X Ø 5.5mm
42.500mm.
42.500mm.
Heatsink Mounting Hole
NB Location