Справочник Пользователя для Intel E8501
Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
29
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
6.6
Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
general recommendations are shown in
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
general recommendations are shown in
.
NOTES:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
§
Table 6-2. Reliability Guidelines
Test
(1)
Requirement
Pass/Fail Criteria
(2)
Mechanical
Shock
Shock
50 g, board level, 11 msec, 3 shocks/axis
Visual Check and Electrical Functional
Test
Test
Random
Vibration
Vibration
7.3 g, board level, 45 min/axis, 50 Hz to
2000 Hz
2000 Hz
Visual Check and Electrical Functional
Test
Test
Temperature Life
85°C, 2000 hours total, checkpoints at 168,
500, 1000, and 2000 hours
500, 1000, and 2000 hours
Visual Check
Thermal Cycling
–5°C to +70°C, 500 cycles
Visual Check
Humidity
85% relative humidity, 55°C, 1000 hours
Visual Check