Справочник Пользователя для Intel E8501

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The reference thermal solution for the chipset NB component is a passive extruded heatsink with 
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. 

shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in 

 contains vendor information for each thermal solution component.

42.50 mm.

6

4

.52 m

m

.

64.52 mm.

55.

09

  

m

m

.

Motherboard

4

 mm.

4.

29

 m

m

.

40.

50

 m

m

.