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Mobile Intel

915GME Express Chipset —Getting Started

Mobile Intel

915GME Express Chipset

Development Kit User’s Manual

April 2007

Order Number: 317230-001US

2.0

Getting Started

This chapter identifies the evaluation kit’s key components, features and specifications.

It also details basic board setup and operation.

2.1

Overview

The evaluation board consists of a baseboard populated with the Mobile Intel

915GME

Express Chipset , other system board components, and peripheral connectors.

Note:

The evaluation board is shipped as an open system allowing for maximum flexibility in

changing hardware configuration and peripherals. Since the board is not in a protective

chassis, take extra precaution when handling and operating the system.

2.1.1

Mobile Intel

915GME Express Chipset Features

Features of the development kit board are summarized below:

Processor

• Supports Intel

Pentium

M Processor with 2 MByte L2 Cache on 90 nm process in

the 478 pin Flip Chip Pin Grid Array (Micro-FCPGA) package

— Supported processors are the Intel

Pentium

M 760 Processor and the Intel

Pentium

M 738 Processor

• Supports Intel

Celeron

M Processor on 90 nm process in the 478 pin Flip Chip

Pin Grid Array (Micro-FCPGA) package

— Supported processors are the Intel

Celeron

M 370 Processor and the Intel

Celeron

M 373 Processor

Note:

This reference platform does not support the Intel

Pentium

M 745 Processor.

Mobile Intel

915GME Express Graphics Memory Controller Hub (915GME

Express GMCH)

• 1257 pin Micro-FCBGA Package
• Supports a 400/533 MHz front side bus
• Dual-Channel DDR2 at 400/533 MHz
• Two SODIMM slots (one per channel) support DDR2 SODIMMS (unbuffered, non-

ECC) modules

• Supports 128 MBytes to 2 GBytes using 256 Mbit, 512 Mbit, or 1 Gbit technology
• x16 PCI Express Graphics or Serial Digital Video Out (SDVO) port
• LVDS, VGA support

I/O Controller Hub 6 (ICH6-M)

• 609 pin plastic BGA package
• DMI (x4) interface with GMCH