Справочник Пользователя для Intel 915GME

Mobile Intel

®

 915GME Express Chipset

April 2007

Development Kit User’s Manual

Order Number: 317230-001US

51

It is necessary for the Mobile Intel

®

 915GME Express Chipset  to have a thermal 

solution attached to the processor in order to keep the processor within its operating 

temperature.

A heat sink is included in the kit. To install the heat sink:

1. Remove heat sink from its package and separate the fan sink portion from the heat 

sink back plate.

2. Examine the base of the heat sink, where contact with the processor die is made. 

There is a white Thermal Interface Material (TIM) on the surface. Do not add any 

additional TIMs on top of this white material.

3. Place the back plate on the underside of the board so that the pins protrude 

through the holes in the system board around the processor.