Справочник Пользователя для Intel E8500

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The system designer must make temperature measurements to accurately determine the thermal 
performance of the system. Intel has established guidelines for proper techniques to measure the 
NB/XMB die temperatures. 

 provides guidelines on how to accurately measure the 

NB/XMB die temperatures. 

 contains information on running an application program 

that will emulate anticipated maximum thermal design power. The flowchart in 

 offers 

useful guidelines for thermal performance and evaluation.

To ensure functionality and reliability, the T

case

 of the NB/XMB must be maintained at or between 

the maximum/minimum operating range of the temperature specification as noted in 

 and 

. The surface temperature at the geometric center of the die corresponds to T

case

. 

Measuring T

case 

requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient 
air can introduce errors in the measurements. The measurement errors could be due to a poor 
thermal contact between the thermocouple junction and the surface of the package, heat loss by 
radiation and/or convection, conduction through thermocouple leads, and/or contact between the 
thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement 
accuracy, only the 0° thermocouple attach approach is recommended.

Zero Degree Angle Attach Methodology

1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of 

the heatsink base. 

2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one 

edge of the heatsink. The slot should be parallel to the heatsink fins (see 

3. Attach thermal interface material (TIM) to the bottom of the heatsink base. 

4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts 

should match the slot and hole milled into the heatsink base.

5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of 

the top surface of the die using a high thermal conductivity cement. During this step, ensure no 
contact is present between the thermocouple cement and the heatsink base because any contact 
will affect the thermocouple reading. It is critical that the thermocouple bead makes 
contact with the die (see 

).

6. Attach heatsink assembly to the NB/XMB and route thermocouple wires out through the 

milled slot.