Справочник Пользователя для Intel E8500
NB Reference Thermal Solution #1
24
Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB
thermal solution are shown in
requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB
thermal solution are shown in
.
When using heatsinks that extend beyond the NB reference heatsink envelope shown in
, any motherboard components placed between the heatsink and motherboard cannot
exceed 4.14 mm (0.16 in.) in height.
Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs.
Approach Velocity
0.80
0.90
1.00
1.10
1.20
1.30
1.40
1.50
100
200
300
400
500
600
700
Flow Rate (LFM)
Ȍ
ca
(°C/W)
Ȍ