Справочник Пользователя для Intel GME965

316704-001 / Development Kit User’s Manual   

 15 

This chapter identifies the development kit’s key components, features and 

specifications. It also details basic development board setup and operation. 

The development board consists of a baseboard populated with the Intel

®

 Core

TM

 2 

Duo processor, the Mobile Intel

®

 GME965 Express Chipset, other system board 

components and peripheral connectors. 

Note:  The development board is shipped as an open system allowing for maximum flexibility 

in changing hardware configuration and peripherals. Since the board is not in a 
protective chassis, take extra precaution when handling and operating the system. 

Features of the development board are summarized in 

Table 6

. 

Processor 

Intel

®

 Core

TM

 2 Duo processor with 

4 MByte L2 Cache on 65nm process 

FSB 533/667/800 MHz support 

478 pin Flip Chip Pin Grid Array (Micro-
FCPGA) package 

Mobile Intel

®

 GME965 Express 

Chipset (GMCH) 

1299-pin Micro-FCBGA Package 

Chipset 

Intel

®

 I/O Controller Hub 8-M 

Enhanced (ICH8M-E) 

676-pin BGA Package 

Memory 

Two DDR2 RAM SO-DIMM slots.   

Maximum 4GB of DDR2 Memory (RAM)  
using 1Gb technology and stacked SO-
DIMMs. 

Supports DDR2 frequency of 533 or 
667MHz 

Video 

One PCI Express* Graphics Slot 

One dual channel LVDS Connector 

One VGA Connector 

One TV D-Connector supporting S-
Video, Composite video and 
Component video 

The Mobile Intel

®

 GME965 Express Chipset 

(GMCH) has 2 video pipes which allows 
support of dual independent display. 

18-bpp and 24-bpp LVDS panel support 

Support for two SDVO channels via x16 
PCIe connector (through ADD2 or MEC 
cards) 

 

 

 

F 

E 

A 

T 

U 

R 

E 

 

 

 

 

 

 

PCI 

One 5V PCI slot 

PCI revision 2.3 compliant (33MHz)