Справочник Пользователя для Intel GME965

316704-001 / Development Kit User’s Manual   

 65 

7.  While keeping the activation arm compressed, place the heatsink over the pins 

of the heatsink backplate. Lower the heatsink until the lugs have inserted into 

the base of the heatsink. Slide the heatsink over the lugs on the backplate 

pins so that the base is directly over the processor die and the pins on the 

backplate have travelled the entire length of the channel in the heatsink base. 

Slowly let go of the activation arm until the base of the heatsink makes 

contact with the processor die. The heatsink base should be flat on top of the 

processor die. 

 

8.  Plug the fan connector for the heatsink onto the CPU fan header (J2B3) on the 

motherboard. 

Note:  The CPU fan header (J2B3) is a 3-pin connector. This is a change from the Mobile 

Intel® 945GM Express Chipset Development Kit which has a 2-pin CPU fan header. As 
a result, it is not possible to use the heatsink from the Intel® 945GM Express Chipset 
Development Kit even though the heatsink and backplate are mechanically 
compatible.