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AMD Geode™ LX Processors Data Book 
33234H
DQM[7:0]
N30, H29, 
C24, A19, 
B10, A6, 
G2, M1
I/O
166-400 Mb/s
2.5
Data Mask Control Bits. During memory read 
cycles, these outputs control whether the 
SDRAM output buffers are driven on the Mem-
ory Data Bus or not. All DQM signals are 
asserted during read cycles.
During memory write cycles, these outputs con-
trol whether or not memory data is written into 
the SDRAM.
DQM[0] is associated with MD[7:0].
DQM[7] is associated with MD[63:56].
DQ[63:0]
I/O
166-400 Mb/s
2.5
Memory Data Bus.
3.4.3
Memory Interface Signals (DDR) (Continued)
Signal Name
Ball No.
Type
f
V
Description
3.4.4
Internal Test and Measurement Interface Signals
Signal Name
Ball No.
Type
f
V
Description
TCLK
AC2
I
0-66 MHz
3.3
Test Clock. JTAG test clock.
TMS
AA4
I
0-66 Mb/s
3.3
Test Mode Select. JTAG test mode select.
TDI
AB3
I
0-66 Mb/s
3.3
Test Data Input. JTAG serial test data input.
TDO
AC1
O
0-66 Mb/s
3.3
Test Data Output. JTAG serial test data output.
TDBGI
AB2
I
0-400 Mb/s
3.3
Test Debug Input. The Debug Management 
Interrupt (DMI) is input via TDBGI. The selects 
for TDBGI are MSR programmable via the GLCP 
module. When using TDBGI for DMI, it cannot be 
used for other debug purposes. DMI can be 
setup via the GLCP module to be edge sensitive 
or level sensitive
TDBGO
AB4
(PD)
0-400 Mb/s
3.3
Test Debug Output. The AMD Geode LX pro-
cessor can output internal clocks on TDBGO. 
The selects for TDBGO are MSR programmable 
via the GLCP module. The internal clock can be 
selected from any clock domain and may be 
divided down by 2 or 3 before output. This 
enables tester and board level visibility of the 
internal clock quality.