Справочник Пользователя для Lucent Technologies APX 1000

APX

® 

1000 Universal Gateway

 

 
 

 
Hardware Technical Specifications 

 
8. Physical Dimensions 
    14.8” (D) x 17.2” (W) x 5.20” (H) (3 rack units) 3RU 
    Loaded system weight: 39 lbs. (approximate) 
 
9. Chassis Architecture 
    6 slots total 
    1 dedicated slot for system controller module 
    1 dedicated slot for channel ingress card 
    4 general purpose slots for port processing, circuit and  
    packet modules 
 
10. Universal Port Density 
      576 voice/data calls – via Channelized T1 
      672 voice/data calls – via Channelized DS3 
      720 voice/data calls – via Channelized E1 
 
11. Serviceability/Redundancy 
      Packet, circuit and processing modules hot-swappable 
      All modules and fan tray field-replaceable 
      Three (3) independent cooling fans with system     
      monitored fan-fail signals removable fan tray 
      AC and DC power supply units 

- Hot-swappable, 1+1 redundant, load sharing, AC    

      input and DC input power supplies 

   - Mixed AC & DC supplies supported in the same   
   chassis 
 

12. APX

® 

     WAN Access Modules 
     Circuit switching (ingress) 
     – 24-port Channelized T1/E1 
     – 8-port Channelized E1 
     – 8-port Channelized T1 
     – 1-port Channelized DS3 
     Packet switching (egress) 
     – 1-port OC3/STM-1 ATM (copper or short-haul fiber or 
     long-haul fiber) 
     – 2- and 4-port 10/100 fast Ethernet 
    Processor Modules/CODEC Support 
    288-port MultiDSP / G.711, G.729 (a and b), G.723.1 
    240-port MultiDSP / G.711, G.729 (a and b), G.723.1 
    96-port MultiDSP / G.711, G.729 (a and b) 
    2nd- generation HDLC 

 

 
 
 
 
 
 
 
 
 
 
 

 
 
 
 
 
 
13. Power Requirements 
      Power budget AC 
     Total typical values per fully loaded chassis: 
      Input power per chassis: 381 W 
      Heat dissipation: 959 BTU/h 
      Current intake @ 100Vac input: 9.6 A* 
      Current intake @ 115Vac input: 7.0 A* 
      Current intake @ 230Vac input: 3.5 A* 
      Recommendations: 
      Input power per chassis: 337 W 
      Heat dissipation: 1150 BTU/h 
      Current intake @ 100Vac Input: 9.6 A* 
      Current intake @ 115Vac Input: 8.5 A* 
      Current intake @ 230Vac Input: 4.2 A* 
      Power budget DC 
      Total typical values per fully loaded chassis: 
      Input power per chassis: 301 W 
      Heat dissipation: 1027 BTU/h 
      Current intake @ -48Vdc input: 16.0 A* 
      Current intake @ -40Vdc input: 20.0 A* 
      Recommendations: 
      Input power per chassis: 361 W 
      Heat dissipation: 1233 BTU/h 
      Current intake @ -48Vdc input: 20.0 A* 
      Current intake @ -40Vdc input: 24.0 A* 
      Configuration: 
      1 x controller module, 3 x 288-port MultiDSP modules,   
      1 x DS3, 
      1 x Ethernet, 1 fan tray 
 
       * Per power supply 
 
14. Operating Characteristics 
      Ambient operating temperature: 
      -0 C to 40 C (-5c to +55c for short term per GR63-  
      CORE) 
      Ambient storage temperature: 
      -40 C to +65 C 
      Relative humidity: 
      10% to 95% non-condensing 
      Operating altitude: 
       to 10,000 feet (3,050 M) 
 
15. Regulatory Compliance 
     NEBS: Level 3 compliant, GR-63-CORE, GR-1089-   
     CORE, CLEI coded, available in TIRKS database 
     EMC/EMI: FCC 15 Class A, R&TTE Directive (EN   
     55022, EN 300 386), Class A, EN 61000-3-2, EN     
     61000-3-3, AS/NZS 3548, Class A, CISPR 22 Class A,  
     VCCI Class A, CNS 13438 Class A 
     Safety: CSA NRTL (UL 1950, Third Edition), CSA  
     C22.2, No. 950, Third Edition, R&TTE Directive EN  
     60950 Including Amendments 1, 2, 3, 4, 11, IEC  
     60950 including Amendments 1, 2, 3, 4 
     Telecom: FCC Part 68, IC CS 03, JATE