Справочник Пользователя для IBM EM78P221/2N

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Solderability 

Solder temperature=245

±5°C, for 5 seconds up to the 

stopper using a rosin-type flux 

− 

Step 1:  TCT, 65°C (15 mins)~150°C (15 mins), 10 cycles 

Step 2:  Bake at 125°C, TD (endurance)=24 hrs 

Step 3:  Soak at 30°C/60% , TD (endurance)=192 hrs 

Pre-condition 

Step 4:  IR flow 3 cycles  
 (Pkg thickness: 2.5mm or  
 Pkg volume: 350mm

3

 ----225

±5°C) 

 (Pkg thickness: 2.5mm or  
 Pkg volume: 350mm

3

 ----240

±5°C) 

For SMD IC (such as 
SOP, QFP, SOJ, etc) 

Temperature cycle test 

-65°C (15 mins) ~ 150°C (15 mins), 200 cycles 

− 

Pressure cooker test 

TA =121°C, RH=100%, pressure=2 atm,  
TD (endurance)= 96 hrs 

− 

High temperature / 
High humidity test 

TA=85°C, RH=85% , TD (endurance)=168, 500 hrs 

− 

High-temperature 
storage life 

TA=150°C, TD (endurance)=500, 1000 hrs 

− 

High-temperature 
operating life 

TA=125°C, VCC=Max. Operating Voltage, 
TD (endurance) =168, 500, 1000 hrs 

− 

Latch-up 

TA=25°C, VCC=Max. operating voltage, 150mA/20V 

− 

ESD (HBM) 

TA=25°C, ± 3KV 

ESD (MM) 

TA=25°C, ± 300V 

IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
VDD-VSS(+),VDD_VS
S (-) mode 

An address trap detect is one of the MCU embedded fail-safe functions that detects 
MCU malfunction caused by noise or the like.  Whenever the MCU attempts to fetch an 
instruction from a certain section of ROM, an internal recovery circuit is auto started.  If 
a noise caused address error is detected, the MCU will repeat execution of the program 
until the noise is eliminated.  The MCU will then continue to execute the next program.