Справочник Пользователя для Intel SERVER CHASSIS SR2500 SR2500
Модели
SR2500
Intel® Server System SR2500AL Cooling
Subsystem
Revision – 1.00
Intel order number D31980-004
25
Table 18 Redundant Fan Header Assignment
Fan ID
Mid-plane Fan Header Name
Fan #1 - CPU1 Cooling
FAN_1
Fan #2 - CPU1 Cooling
FAN_2
Fan #3 - CPU2 Cooling
FAN_3
Fan #4 - CPU2 Cooling
FAN_4
Fan #5 - PCI Cooling
FAN_5
Fan #6 - PCI Cooling
FAN_6
The system fan module has been designed for ease of use and has support for several
management features that can be utilized by the server board management system.
management features that can be utilized by the server board management system.
• The fan module houses two different fan sizes. System fans 1, 2, 3 and 4 use an 80mm
fan, while system fans 5 and 6 use a 60mm fan.
• Each fan is designed for tool-less insertion to or removal from the fan module and can
be hot-swapped in the event of failure.
• Each fan within the module is equipped with a failure LED. In the event of a fan failure,
the failure LED on the failing fan can be illuminated by server management.
• Each fan within the module is capable of supporting multiple speeds. If the internal
ambient temperature of the system exceeds the value programmed into the thermal
sensor data record (SDR), the BMC firmware will increase the speed for all the fans
within fan module.
sensor data record (SDR), the BMC firmware will increase the speed for all the fans
within fan module.
• Each fan connector within the module supplies a tachometer signal that allows the BMC
to monitor the status of each fan. If one of the fans should fail, the remaining fans will
increase their rotation and attempt to maintain the thermal requirements of the system.
increase their rotation and attempt to maintain the thermal requirements of the system.
3.3 Air Flow Support
To control airflow within the system, the chassis uses an air baffle and a CPU air duct to isolate
and direct airflow to three critical zones: the power supply zone, the full height PCI riser zone,
and the CPU/memory/low profile PCI riser zone.
and direct airflow to three critical zones: the power supply zone, the full height PCI riser zone,
and the CPU/memory/low profile PCI riser zone.
3.3.1
Power Supply Zone
An air baffle is used to isolate the air flow of the main system board zones from the zone directly
behind the power supply. As the power supply fans pull pre-heated air through the power
supply from inside the chassis, the zone behind it must remain as cool as possible by drawing
air from the leftmost drive bays only.
behind the power supply. As the power supply fans pull pre-heated air through the power
supply from inside the chassis, the zone behind it must remain as cool as possible by drawing
air from the leftmost drive bays only.
3.3.2
Full Height Riser Zone
The full height riser zone is the area between the power supply assembly and the full height
riser card of the riser assembly. The air flow through this area is generated by system fan 3 of
the fan module in a non-redundant fan configuration. In a redundant fan configuration, the air
flow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area
through the fan and pushed out of the system through ventilation holes the back side of the
chassis.
riser card of the riser assembly. The air flow through this area is generated by system fan 3 of
the fan module in a non-redundant fan configuration. In a redundant fan configuration, the air
flow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area
through the fan and pushed out of the system through ventilation holes the back side of the
chassis.