Техническая Спецификация для Intel Pentium III BX80525U550512E
Модели
BX80525U550512E
52
Datasheet
Thermal Specifications and Design Considerations
For S.E.C.C. packaged processors, the extended thermal plate is the attach location for all thermal
solutions. The maximum and minimum extended thermal plate temperatures are specified in
solutions. The maximum and minimum extended thermal plate temperatures are specified in
. For S.E.C.C.2 packaged processors, thermal solutions attach to the processor by
connecting through the substrate to the cover. The maximum and minimum temperatures of the
pertinent locations are specified in
pertinent locations are specified in
. A thermal solution should be designed to ensure the
temperature of the specified locations never exceeds these temperatures.
The total processor power is a result of heat dissipated by the processor core and L2 cache. The
overall system chassis thermal design must comprehend the entire processor power. In S.E.C.C.
packaged processors, the extended thermal plate power is a component of this power, and is
primarily composed of the processor core and the L2 cache dissipating heat through the extended
thermal plate. The heatsink need only be designed to dissipate the extended thermal plate power.
See
overall system chassis thermal design must comprehend the entire processor power. In S.E.C.C.
packaged processors, the extended thermal plate power is a component of this power, and is
primarily composed of the processor core and the L2 cache dissipating heat through the extended
thermal plate. The heatsink need only be designed to dissipate the extended thermal plate power.
See
for current Pentium III processor S.E.C.C. thermal design specifications.
No extended thermal plate exists for S.E.C.C.2 packaged processors, so thermal solutions have to
attach directly to the processor core package. The total processor power dissipated by an S.E.C.C.2
processor is a combination of heat dissipated by both the processor core and L2 cache. Pentium III
processors that use a “Discrete” L2 cache have a separate T
attach directly to the processor core package. The total processor power dissipated by an S.E.C.C.2
processor is a combination of heat dissipated by both the processor core and L2 cache. Pentium III
processors that use a “Discrete” L2 cache have a separate T
CASE
specification (
) for the
surface mounted BSRAM components on the substrate. T
JUNCTION
encompasses the L2 cache for
processors that utilize the “Advanced Transfer Cache”, therefore no separate cache measurement is
required.
required.
Specifics on how to measure these specifications are outlined in AP-905, Intel
®
Pentium
®
III
Processor Thermal Design Guidelines (Document Number 245087).
Figure 20. Processor Functional Die Layout (CPUID=0686h)
Cache Area
0.04 in
2
0.337”
0.275”
0.146”
0.414”
Core Area
0.10 in
2
Die Area
0.14 in
2
Die Area = 0.90 cm
2
Cache Area = 0.26 cm
2
Core Area = 0.64 cm
2
Figure 21. Processor Functional Die Layout (up to CPUID=0683h)
Cache Area
0.05 in
2
0.362”
0.292”
0.170”
0.448”
Core Area
0.11 in
2
Die Area
0.16 in
2
Die Area = 1.05 cm
2
Cache Area = 0.32 cm
2
Core Area = 0.73 cm
2