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AT80601000897AB

Intel® Xeon® Processor 3500 Series Datasheet, Volume 1

Features ..................................................................................................................93
7.1

Power-On Configuration (POC).............................................................................93

7.2

Clock Control and Low Power States.....................................................................93
7.2.1

Thread and Core Power State Descriptions .................................................94

7.2.2

Package Power State Descriptions .............................................................95

7.3

Sleep States .....................................................................................................96

7.4

ACPI P-States (Intel

Turbo Boost Technology) .....................................................96

7.5

Enhanced Intel SpeedStep

Technology ...............................................................97

Boxed Processor Specifications................................................................................99
8.1

Introduction......................................................................................................99

8.2

Mechanical Specifications.................................................................................. 100
8.2.1

Boxed Processor Cooling Solution Dimensions........................................... 100

8.2.2

Boxed Processor Fan Heatsink Weight ..................................................... 102

8.2.3

Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly ... 102

8.3

Electrical Requirements .................................................................................... 102
8.3.1

Fan Heatsink Power Supply .................................................................... 102

8.4

Thermal Specifications...................................................................................... 103
8.4.1

Boxed Processor Cooling Requirements.................................................... 103

8.4.2

Variable Speed Fan ............................................................................... 105

Figures

1-1

High-Level View of Processor Interfaces ................................................................. 9

2-1

Active ODT for a Differential Link Example ............................................................13

2-2

Input Device Hysteresis ......................................................................................21

2-3

VCC Static and Transient Tolerance Load Lines ......................................................25

2-4

VTT Static and Transient Tolerance Load Line ........................................................27

2-5

VCC Overshoot Example Waveform ......................................................................30

3-1

Processor Package Assembly Sketch.....................................................................31

3-2

Processor Package Drawing (Sheet 1 of 2) ............................................................32

3-3

Processor Package Drawing (Sheet 2 of 2) ............................................................33

3-4

Processor Top-Side Markings ...............................................................................35

3-5

Processor Land Coordinates and Quadrants (Bottom View) ......................................36

6-1

Processor Thermal Profile....................................................................................81

6-2

Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ..........83

6-3

Frequency and Voltage Ordering ..........................................................................86

7-1

Power States.....................................................................................................94

8-1

Mechanical Representation of the Boxed Processor .................................................99

8-2

Space Requirements for the Boxed Processor (side view) ...................................... 100

8-3

Space Requirements for the Boxed Processor (top view) ....................................... 101

8-4

Space Requirements for the Boxed Processor (overall view) .................................. 101

8-5

Boxed Processor Fan Heatsink Power Cable Connector Description.......................... 102

8-6

Baseboard Power Header Placement Relative to Processor Socket........................... 103

8-7

Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ............... 104

8-8

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view).............. 104

8-9

Boxed Processor Fan Heatsink Set Points ............................................................ 105