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AU80610006225AA

Datasheet

Contents

Introduction .............................................................................................................8
1.1

Intel® Atom™ Processor D400 and D500 Series Features .........................................8

1.2

System Memory Features .....................................................................................9

1.3

Direct Media Interface Features ........................................................................... 10

1.4

Graphics Processing Unit Features ....................................................................... 10

1.5

Clocking........................................................................................................... 11

1.6

Power Management ........................................................................................... 11
1.6.1

Terminology .......................................................................................... 11

1.7

References ....................................................................................................... 13

1.8

System Block Diagram ....................................................................................... 14

Signal Description.................................................................................................... 15
2.1

CPU Legacy Signal............................................................................................. 16

2.2

System Memory Interface................................................................................... 19

2.3

DMI - Direct Media Interface ............................................................................... 21

2.4

PLL Signals....................................................................................................... 21

2.5

Analog Display Signals ....................................................................................... 22

2.6

LVDS Signals .................................................................................................... 23

2.7

JTAG/ITP Signals............................................................................................... 24

2.8

Error and Thermal Protection .............................................................................. 24

2.9

Processor Core Power Signals.............................................................................. 25

2.10 Graphics, DMI and Memory Core Power Signals ..................................................... 25
2.11 Ground ............................................................................................................ 26

Functional Description ............................................................................................. 27
3.1

System Memory Controller.................................................................................. 27
3.1.1

System Memory Organization Modes......................................................... 27

3.1.2

System Memory Technology Supported ..................................................... 27

3.1.3

Rules for Populating DIMM Slots ............................................................... 30

3.2

Graphics Processing Unit .................................................................................... 30
3.2.1

3D Graphics Pipeline ............................................................................... 31

3.2.2

Video Engine ......................................................................................... 32

3.2.3

2D Engine ............................................................................................. 32

3.2.4

Analog Display Port Characteristics ........................................................... 32

3.2.5

Multiple Display Configurations................................................................. 33

3.3

Thermal Sensor................................................................................................. 33
3.3.1

PCI Device 0, Function 0 ......................................................................... 33

3.4

Power Management ........................................................................................... 34
3.4.1

Main Memory Power Management............................................................. 34

3.4.2

Interface Power States Supported............................................................. 35

3.4.3

State Combinations ................................................................................ 35

3.4.4

System Suspend States........................................................................... 35

Electrical Specifications ........................................................................................... 37
4.1

Power and Ground Balls ..................................................................................... 37

4.2

Decoupling Guidelines ........................................................................................ 37
4.2.1

Voltage Rail Decoupling........................................................................... 37

4.3

Processor Clocking............................................................................................. 38

4.4

Voltage Identification (VID) ................................................................................ 38