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Intel® Xeon® Processor 7500 Datasheet, Volume 1
113
Thermal Specifications
6
Thermal Specifications
6.1
Package Thermal Specifications
The Intel® Xeon® processor 7500 series requires a thermal solution to maintain
temperatures within its operating limits. Any attempt to operate the processor outside
these operating limits may result in permanent damage to the processor and
potentially other components within the system. For more information on designing a
component level thermal solution, refer to the Intel® Xeon® Processor 7500 Series
Thermal and Mechanical Design Guide.
temperatures within its operating limits. Any attempt to operate the processor outside
these operating limits may result in permanent damage to the processor and
potentially other components within the system. For more information on designing a
component level thermal solution, refer to the Intel® Xeon® Processor 7500 Series
Thermal and Mechanical Design Guide.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (T
systems, the processor must remain within the minimum and maximum case
temperature (T
CASE
) specifications as defined by the applicable thermal profile (see
and
for 105W
and
for 95W TDP processors). Thermal
solutions not designed to provide this level of thermal capability may affect the long-
term reliability of the processor and system. For more details on thermal solution
design, please refer to the Intel® Xeon® Processor 7500 Series Thermal and
Mechanical Design Guide.
term reliability of the processor and system. For more details on thermal solution
design, please refer to the Intel® Xeon® Processor 7500 Series Thermal and
Mechanical Design Guide.
The Intel® Xeon® processor 7500 series implements a methodology for managing
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and to ensure processor reliability. Selection of the appropriate fan
speed is based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI) bus as described in
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and to ensure processor reliability. Selection of the appropriate fan
speed is based on the relative temperature data reported by the processor’s Platform
Environment Control Interface (PECI) bus as described in
. The temperature
reported over PECI is always a negative value and represents a delta below the onset of
thermal control circuit (TCC) activation, as indicated by PROCHOT_N (see
thermal control circuit (TCC) activation, as indicated by PROCHOT_N (see
). Systems that implement fan speed control
must be designed to use this data. Systems that do not alter the fan speed only need to
guarantee that the case temperature meets the thermal profile specifications.
guarantee that the case temperature meets the thermal profile specifications.
Intel has developed a thermal profile that can be implemented with the 130W TDP
processor to ensure adherence to Intel reliability requirements. The 130W TDP Thermal
profile (see
processor to ensure adherence to Intel reliability requirements. The 130W TDP Thermal
profile (see
) is representative of a volumetrically unconstrained
thermal solution (that is, industry enabled 4U heatsink). In this scenario, it is expected
that the Thermal Control Circuit (TCC) would only be activated for very brief periods of
time when running the most power intensive applications. Intel has developed the
thermal profile to allow customers to choose the thermal solution and environmental
parameters that best suit their platform implementation.
that the Thermal Control Circuit (TCC) would only be activated for very brief periods of
time when running the most power intensive applications. Intel has developed the
thermal profile to allow customers to choose the thermal solution and environmental
parameters that best suit their platform implementation.
The 105W TDP processor (see
;
) is representative of a
volumetrically constrained thermal solution (that is, industry enabled 2U heatsink). In
this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive