Техническая Спецификация для Intel QX9775 EU80574XL088N
Модели
EU80574XL088N
Mechanical Specifications
40
Datasheet
3.4
Package Handling Guidelines
includes a list of guidelines on a package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
NOTES:
1.
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top
surface.
surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the
IHS surface.
IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal
to the IHS top surface.
to the IHS top surface.
4.
These guidelines are based on limited testing for design characterization and incidental
applications (one time only).
applications (one time only).
5.
Handling guidelines are for the package only and do not include the limits of the processor
socket.
socket.
3.5
Package Insertion Specifications
The processor can be inserted and removed 15 times from an LGA771 socket, which
meets the criteria outlined in the LGA771 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the processor is 21.5 grams [0.76D oz.]. This includes all
components which make up the entire processor product.
3.7
Processor Materials
The processor is assembled from several components. The basic material properties
are described in
.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Units
Notes
Shear
311
70
N
lbf
1,4,5
Tensile
111
25
N
lbf
2,4,5
Torque
3.95
35
N-m
LBF-in
3,4,5
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel over copper
Substrate
Fiber-reinforced resin
Substrate Lands
Gold over nickel