Справочник Пользователя для Intel Xeon E5420 SLANV
Модели
SLANV
2
Platform Configurations
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
Figure 2: Intel® 5000P chipset-based platforms
Intel® 5000P
Memory
Controller Hub
DDR2 FB-DIMM
Intel®
6321ESB
I/O
Controller
Hub
Up to 2x
1333 MHz
Configurable PCI Express*
with 28 lanes
Configurable up to
64 GB max memory
DDR2 FB-DIMM
DDR2 FB-DIMM
DDR2 FB-DIMM
Intel® Xeon®
Processor 5400,
5200 or 3000
4
Series
Intel® Xeon®
Processor 5400
or 5200 Series
Up to 2x
1333 MHz
Intel® Xeon®
Processor 5400,
5200 or 3000
4
Series
Intel® Xeon®
Processor 5400
or 5200 Series
Intel® 5100
Memory
Controller Hub
Configurable up to
48 GB max memory
DDR2 533/667
DDR2 533/667
Intel® I/O
Controller
Hub 9R
24 PCI Express lanes configurable
as x4, x8, or x16 wide links
6 PCI Express* lanes
configurable as 1 x4
or 6 x1 wide links
Figure 3: Intel® 5100 Memory Controller Hub
chipset-based platforms
• Intel® 5000P chipset-based platforms are ideal for full
performance and memory-intense applications by providing
a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of
PCI Express*, and accelerated I/O options. This platform offers
quick migration for customers with existing Intel 5000P
chipset-based designs due to the LGA 771 socket, common
with the quad-core 5300 series and dual-core 5100 series,
eliminating software tuning and minimizing hardware
qualification efforts (see Figure 2).
a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of
PCI Express*, and accelerated I/O options. This platform offers
quick migration for customers with existing Intel 5000P
chipset-based designs due to the LGA 771 socket, common
with the quad-core 5300 series and dual-core 5100 series,
eliminating software tuning and minimizing hardware
qualification efforts (see Figure 2).
• Intel® 5100 Memory Controller Hub (MCH) chipset-based
platforms are ideal for bladed and dense bladed applications
requiring less than 200 watts, including AdvancedTCA* and
NEBS-compliant solutions. Platform power savings is derived
from lower TDP in the MCH (25.7 watts TDP at 1333 MHz
front-side bus [FSB] and 23.0 watts TDP at 1066 MHz FSB),
the efficient next-generation Intel® I/O Controller Hub 9R at
4.3W TDP, and standard native DDR2 memory technology
with a maximum capacity of 48 GB (see Figure 3).
requiring less than 200 watts, including AdvancedTCA* and
NEBS-compliant solutions. Platform power savings is derived
from lower TDP in the MCH (25.7 watts TDP at 1333 MHz
front-side bus [FSB] and 23.0 watts TDP at 1066 MHz FSB),
the efficient next-generation Intel® I/O Controller Hub 9R at
4.3W TDP, and standard native DDR2 memory technology
with a maximum capacity of 48 GB (see Figure 3).