Техническая Спецификация для Intel Xeon Dual-Core 5050 HH80555KF0804M
Модели
HH80555KF0804M
Mechanical Specifications
38
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
10. R is defined as the radial distance from the center of the LGA771 socket ball array to the center of heatsink
load reaction point closest to the socket.
11. Applies to populated sockets in fully populated and partially populated socket configurations.
12. Through life or product. Condition must be satisfied at the beginning of life and at the end of life.
13. Rigid back is not allowed. The board should flex in the enabled configuration.
3.4
Package Handling Guidelines
includes a list of guidelines on a package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
Notes:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5.
Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The Dual-Core Intel Xeon Processor 5000 Series can be inserted and removed 15 times
from an LGA771 socket.
from an LGA771 socket.
3.6
Processor Mass Specifications
The typical mass of the Dual-Core Intel Xeon Processor 5000 series is 21.5 grams [0.76
oz.]. This includes all components which make up the entire processor product.
oz.]. This includes all components which make up the entire processor product.
3.7
Processor Materials
The Dual-Core Intel Xeon Processor 5000 series are assembled from several
components. The basic material properties are described in
components. The basic material properties are described in
.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Units
Notes
Shear
311
70
N
lbf
1,4,5
Tensile
111
25
N
lbf
2,4,5
Torque
3.95
35
N-m
LBF-in
3,4,5
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel over copper
Substrate
Fiber-reinforced resin
Substrate Lands
Gold over nickel