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1
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO
THE
MANUFACTURER
. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF
THE MANUFACTURER
.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE NF18GF MOTHER-BOARD AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE.
MANUFACTURER
PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES
(INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion
Revision History
Date
3.0
Third Edition
October 2003
Item Checklist
5
NF18GF Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
5
Cable for 1394 Ports (Option)
5
SPDIF-IN/SPDIF-OUT Adaptor
5
VGA Port 2 Bracket (Option)
5
NF18GF User’s Manual
AMD Athlon™ / Duron™ Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal management becomes
increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to
reliable, long-term system operation. The overall goal in providing the proper thermal environment is keeping
the processor below its specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increased surface area and concentrated airflow from attached fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For optimum heat transfer,
AMD recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.
increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to
reliable, long-term system operation. The overall goal in providing the proper thermal environment is keeping
the processor below its specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increased surface area and concentrated airflow from attached fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For optimum heat transfer,
AMD recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heatsinks evaluated and recommended by AMD for use with AMD processors. Note, those heatsinks are
recommended for maintaining the specified Maximum T case requirement. In addition, this collection is not
intended to be a comprehensive listing of all heatsinks that support AMD processors.
heatsinks evaluated and recommended by AMD for use with AMD processors. Note, those heatsinks are
recommended for maintaining the specified Maximum T case requirement. In addition, this collection is not
intended to be a comprehensive listing of all heatsinks that support AMD processors.
For vendor list of heatsink and fan, please visit：
http://www1.amd.com/products/duron/thermals
http://www1.amd.com/products/athlon/thermals
http://www1.amd.com/products/duron/thermals
http://www1.amd.com/products/athlon/thermals