Справочник Пользователя для Intel 4 1.50 GHz BX80528JK150G
Модели
BX80528JK150G
Intel
®
Pentium
®
4 Processor in the 423-pin Package
85
8.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
processor.
8.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Chapter 6.0 of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see Table 33) in chassis that provide good thermal
management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow
provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of
the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through
the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life. Figure 33 and Figure 34 illustrate an acceptable airspace
clearance for the fan heatsink. The air temperature entering the fan should be kept below 40°C.
Again, meeting the processor's temperature specification is the responsibility of the system
integrator.
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in Chapter 6.0 of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see Table 33) in chassis that provide good thermal
management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow
provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of
the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through
the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life. Figure 33 and Figure 34 illustrate an acceptable airspace
clearance for the fan heatsink. The air temperature entering the fan should be kept below 40°C.
Again, meeting the processor's temperature specification is the responsibility of the system
integrator.
Figure 32. Acceptable System Board Power Header Placement
Relative to Processor Socket