Справочник Пользователя для Ione 4NE980NH
Scorplus 980NH plus /980H Keyboard SPECIFICATIONS
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. Universal serial Bus specification
*Receptacle Injection Molded Thermoplastic Insulator
Material :
Minimum UL 94-V0 rated, thirty percent (30%) glass–filled
polybutylene terehthalate (PBT) or polyethylene terephthalate(PET)
or Natural.
Typical Colors: Black, Gray and Natural.
Flammability Characteristics: UL 94-V0 rated.
Flame Retardant Package must meet or exceed the requirements
for UL, CSA, VDE, et cetera.
Oxygen Index (LOI) : Greater than 21% ASTM D2863
polybutylene terehthalate (PBT) or polyethylene terephthalate(PET)
or Natural.
Typical Colors: Black, Gray and Natural.
Flammability Characteristics: UL 94-V0 rated.
Flame Retardant Package must meet or exceed the requirements
for UL, CSA, VDE, et cetera.
Oxygen Index (LOI) : Greater than 21% ASTM D2863
*Receptacle Shell Materials :
Substrate Material: 0.3 + 0.05mm phosphor bronze, nickel silver or
other copper based high strength materials.
Plating:
1.Underplate: Optional. Minimum 1.00 micrometers (40 microinches)
Nickel. In addition, Manufacturer May use a copper underplat
beneath the nickel.
2.Outside; Minimum 2.5 micrometers (100 microinches) Bright Tin or
Bright Tin-Lead.
*Receptacle Contact Materials :
SubstrateMaterial:0.3+ 0.05mm minimum half-hard phosphor
bronze or other the high strength copper based material.
Plating; contact are to be selectively plated.
Option
1.Undeplate: Minimum 1.25 micrometers (50 microinches ) Nickel.
Copper over base material is optional.
Substrate Material: 0.3 + 0.05mm phosphor bronze, nickel silver or
other copper based high strength materials.
Plating:
1.Underplate: Optional. Minimum 1.00 micrometers (40 microinches)
Nickel. In addition, Manufacturer May use a copper underplat
beneath the nickel.
2.Outside; Minimum 2.5 micrometers (100 microinches) Bright Tin or
Bright Tin-Lead.
*Receptacle Contact Materials :
SubstrateMaterial:0.3+ 0.05mm minimum half-hard phosphor
bronze or other the high strength copper based material.
Plating; contact are to be selectively plated.
Option
1.Undeplate: Minimum 1.25 micrometers (50 microinches ) Nickel.
Copper over base material is optional.
2.Mating Area: Minimum 0.05 micrometers (2 microinches) Gold over
a minimum of 0.70 micrometrs (28 microinches) Palladium.
a minimum of 0.70 micrometrs (28 microinches) Palladium.
3.Solder Tails: Minimum 3.8 micrometers (150 microinches) Bright
Tin-Lead over the underplate.
Tin-Lead over the underplate.