Справочник Пользователя для Samtec Inc OSM-1-1313
OSM-1-1313 Ver-
10
UNITED STATES • NORTHERN CALIFORNIA • SOUTHERN CALIFORNIA • SOUTH AMERICA • UNITED KINGDOM • GERMANY • FRANCE • ITALY • NORDIC/BALTIC
BENELUX • ISRAEL • INDIA • AUSTRALIA / NEW ZEALAND • SINGAPORE • JAPAN • SHANGHAI • SHENZHEN • TAIWAN • HONG KONG • KOREA
JULY 2016 Rev -
SAMTEC Proprietary
SAMTEC Proprietary
MODULE OUTPUT CONFIGURATION (Minimal)
Figure 7 – Minimal Connections to Operate Module
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Do we need to add anything here? David Decker is working this
CLEANING
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily
removed with any cleaning process.
removed with any cleaning process.
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board
and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits
between neighboring pads. Water could also damage any stickers or labels.
between neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield,
which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.