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FF8062701065100

Datasheet

Features ..................................................................................................................83
7.1

Power-On Configuration (POC).............................................................................83

7.2

Clock Control and Low Power States.....................................................................83
7.2.1

Thread and Core Power State Descriptions .................................................84

7.2.2

Package Power State Descriptions .............................................................85

7.3

Sleep States .....................................................................................................86

7.4

ACPI P-States (Intel

Turbo Boost Technology) .....................................................86

7.5

Enhanced Intel

SpeedStep

Technology .............................................................87

Boxed Processor Specifications................................................................................89
8.1

Introduction......................................................................................................89

8.2

Mechanical Specifications....................................................................................90
8.2.1

Boxed Processor Cooling Solution Dimensions.............................................90

8.2.2

Boxed Processor Fan Heatsink Weight .......................................................92

8.2.3

Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....92

8.3

Electrical Requirements ......................................................................................92
8.3.1

Fan Heatsink Power Supply ......................................................................92

8.4

Thermal Specifications........................................................................................93
8.4.1

Boxed Processor Cooling Requirements......................................................93

8.4.2

Variable Speed Fan .................................................................................95

Figures

1-1

High-Level View of Processor Interfaces ................................................................. 9

2-1

Active ODT for a Differential Link Example ............................................................13

2-2

Input Device Hysteresis ......................................................................................21

2-3

VCC Static and Transient Tolerance Load Lines ......................................................25

2-4

VTT Static and Transient Tolerance Load Line ........................................................27

2-5

VCC Overshoot Example Waveform ......................................................................30

3-1

Processor Package Assembly Sketch.....................................................................31

3-2

Processor Package Drawing (Sheet 1 of 2) ............................................................32

3-3

Processor Package Drawing (Sheet 2 of 2) ............................................................33

3-4

Processor Top-side Markings ...............................................................................35

3-5

Processor Land Coordinates and Quadrants (Bottom View) ......................................36

6-1

Processor Thermal Profile....................................................................................73

6-2

Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ..........75

6-3

Frequency and Voltage Ordering ..........................................................................77

7-1

Power States.....................................................................................................84

8-1

Mechanical Representation of the Boxed Processor .................................................89

8-2

Space Requirements for the Boxed Processor (side view) ........................................90

8-3

Space Requirements for the Boxed Processor (top view) .........................................91

8-4

Space Requirements for the Boxed Processor (overall view) ....................................91

8-5

Boxed Processor Fan Heatsink Power Cable Connector Description............................92

8-6

Baseboard Power Header Placement Relative to Processor Socket.............................93

8-7

Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) .................94

8-8

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)................94

8-9

Boxed Processor Fan Heatsink Set Points ..............................................................95