Листовка для In Win BL672 IW-BL672.300TBLF

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IW-BL672.300TBLF
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Design Philosophy
A small 11.5L SFF chassis with optimal thermal and acoustic performance 
without additional system fan.
Multi-Enjoyment
High Compatibility
It is compatible with standard desktop components, which makes the installation 
easier and provides a great expandability when needed.
Optional screwless designs-ODD/FDD/HDD 
bays, expansion slots,
and top cover.
Tool Free
For easy installation.
Detachable Drive Cage
New Partition Plate Cooling Technology (PPCT)
It  provides  SFF  chassis  excellent  thermal  solutions  while 
creating  a  quieter  computing  experience.  The  second 
generation of PPCT includes a removable air duct and an 
enlarged adjustable vent for various positions within your 
PC.  The  New  Partition  Plate  Cooling  Technology  also
PPCT is the world’s first advanced thermal and acoustic cooling technology. 
supports the LGA1156 socket.
Designated Infrared Receiver position to support Media Center and optional 
Internal amplifier.
 
 
CASE SIZE
PROCESSOR
EXTERNAL DRIVE BAY
INTERNAL DRIVE BAY
FRONT PORTS
DIMENSIONS (HxWxD)
w/o Front Panel
M/B
I/O EXPANSION SLOTS
POWER SUPPLY
THERMAL SOLUTION
SAFETY
 SECURITY
OPTIONAL
S.F.F Slim Chassis
Support Dual Core and Quad Core Processor
5.25" x 1, 3.5" x1
3.5" x 2
USB 2.0 x 4, HD Audio
13" x 3.8" x 14.4" 
330 x 96 x 365 mm (11.5L) 
Micro ATX
Low Profile Slot x 4
Standard TFX 12V
Removable air filter, 80mm side fan
Meets RoHS, CE and FCC Class B Requirements
Padlock Loop / Kensington Slot
Intel Lanyu Ref. Design-New Partition Plate Cooling Tech 
  (New PPCT) 
IR / IEEE 1394 / Chassis Intrusion  Switch
Tool-Free ODD/FDD/HDD Bays Clips
Tool-Free Expansion Slots Clip
Tool-FreeTop Cover Clips
BL672
BL672
mATX Chassis
*Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United 
  States and other countries.
*The actual product is subject to change without prior notice. In Win Development Inc. reserves the 
  right to make final modifications.