Справочник Пользователя для Intel E5-2403 CM8062001048300

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

237

Datasheet Volume One

The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that 

interfaces with the baseboard via an LGA2011-0 land FCLGA10 socket. The package 
consists of a processor mounted on a substrate land-carrier. An integrated heat 

spreader (IHS) is attached to the package substrate and core and serves as the mating 

surface for processor component thermal solutions, such as a heatsink. 

shows a sketch of the processor package components and how they are assembled 

together. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product 
Families Thermal/Mechanical Design Guide 

for complete details on the LGA2011-0 land 

FCLGA10 socket.

The package components shown in 

1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors

1.

Socket and baseboard are included for reference and are not part of processor package.

The package mechanical drawings are shown in 

. The 

drawings include dimensions necessary to design a thermal solution for the processor. 

These dimensions include:

1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions

 

IHS 

Substrate  

 

 

System Board

 

Capacitors  

 

TIM 

LGA2011-0 Socket

Die