Справочник Пользователя для Intel PentiumD 950 HH80553PG0964M
Модели
HH80553PG0964M
Datasheet
13
Introduction
• Intel
®
975X Express chipset — Chipset that supports DDR2 memory technology
for the processor.
• Processor core — Processor core die with integrated L2 cache.
• LGA775 socket — The processor mates with the system board through a surface
• LGA775 socket — The processor mates with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material), the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
1.2
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1.
References
Document
Location
Intel
®
Pentium
®
D Processor 900 Sequence and Intel
®
Pentium
®
Processor Extreme Edition 955, 965 Specification Update
http://www.intel.com/
design/pentiumXE/
specupdt/310307.htm
design/pentiumXE/
specupdt/310307.htm
Intel
®
Pentium
®
D Processor, Intel
®
Pentium
®
Processor Extreme
Edition, and Intel
®
Pentium
®
4 Processor Thermal and Mechanical
Design Guidelines
http://www.intel.com/
design/pentiumXE/
designex/306830.htm
design/pentiumXE/
designex/306830.htm
Voltage Regulator-Down (VRD) 10.1 Design Guide For Desktop and
Transportable LGA775 Socket
Transportable LGA775 Socket
http://intel.com/design/
Pentium4/guides/
302356.htm
Pentium4/guides/
302356.htm
Intel
®
Virtualization Technology Specification for the IA-32 Intel
®
Architecture
http://www.intel.com/
technology/computing/
vptech/index.htm
technology/computing/
vptech/index.htm
LGA775 Socket Mechanical Design Guide
http://intel.com/design/
Pentium4/guides/
302666.htm
Pentium4/guides/
302666.htm
Balanced Technology Extended (BTX) System Design Guide
www.formfactors.org