Техническая Спецификация для Intel Quad-core Intel Xeon DP L5335 Passive BX80563L5335P

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Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
113
Boxed Processor Specifications
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor. 
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is 
required around the thermal solution to ensure unimpeded airflow for proper cooling. 
The physical space requirements and dimensions for the boxed processor and 
assembled heat sink are shown in 
 through 
 are the mechanical drawings for the 4-pin board fan header and 4-pin 
connector used for the active CEK fan heat sink solution.