Справочник Пользователя для Intel DQ35JO, 10-Pack BLKDQ35JOE?KIT
Модели
BLKDQ35JOE?KIT
Ordering Information: See the Intel Web site at www.intel.com.
For the most current product information and ordering information visit intel.com/go/idb
For the most current product information and ordering information visit intel.com/go/idb
1
System resources (such as PCI and PCI Express*) require physical memory address locations that reduce available memory addresses above 7 GB. This may result in less than 8 GB
of memory being available to the operating system and applications.
Desktop PCs with Intel® vPro™ technology and Intel® 64 architecture (Intel® 64) require a computer system with a processor, chipset, BIOS, enabling software and/ or operating system,
Desktop PCs with Intel® vPro™ technology and Intel® 64 architecture (Intel® 64) require a computer system with a processor, chipset, BIOS, enabling software and/ or operating system,
device drivers, and applications designed for these features. Performance will vary depending on your configuration. Use of Intel® Active Management Technology (Intel® AMT) and
Intel® Virtualization Technology (Intel® VT) with this desktop board will require networking software, connection with a power source, and a network connection for Intel AMT, as well
as an enabled Intel® processor, BIOS, virtual machine monitor (VMM), and for some uses, certain platform software enabled for Intel VT. Contact your vendor for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel vPro, the Intel vPro logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved. 0707/MS/NW/PDF
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel vPro, the Intel vPro logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007 Intel Corporation. All rights reserved. 0707/MS/NW/PDF
317927-001US
Technical Specifications
Processor
Processor Support
• Intel® Core™2 Quad and Intel® Core™2 Duo
processors in the LGA775 package
• Supports Intel® 64 Architecture
• Intel® Core™2 Quad and Intel® Core™2 Duo
processors in the LGA775 package
• Supports Intel® 64 Architecture
Chipset
Intel® Q35 Express Chipset
• Intel® 82Q35 Graphics Memory Controller Hub
(GMCH)
• Intel® 82801IDO I/O Controller Hub (ICH9DO)
• Intel® Active Management Technology
Architecture Specification 3.0
• Intel® Matrix Storage Technology (RAID 0, 1, 5, 10)
with Intel® Rapid Recover Technolgoy
• Intel® Fast Memory Access
Graphics Memory Controller Hub (GMCH)
• Designed to support up to 8 GB
• Intel® 82Q35 Graphics Memory Controller Hub
(GMCH)
• Intel® 82801IDO I/O Controller Hub (ICH9DO)
• Intel® Active Management Technology
Architecture Specification 3.0
• Intel® Matrix Storage Technology (RAID 0, 1, 5, 10)
with Intel® Rapid Recover Technolgoy
• Intel® Fast Memory Access
Graphics Memory Controller Hub (GMCH)
• Designed to support up to 8 GB
1
of system
memory using DDR2 800 / 667 SDRAM
memory
• Intel® Fast Memory Access
• Intel® Graphics Media Accelerator X3100 with
Intel® Clear Video Technology
• DVI-D and VGA integrated graphics—
DQ35JO only
Intel® I/O Controller Hub
• Supports two Ultra ATA 100 / 66 devices
• Six SATA (3.0 Gb/s) ports with port multiplier,
including one eSATA port
• Intel® PRO 10 / 100 / 1000 network connection
USB 2.0
Integrated Intel® ICH9DO controllers:
• Six back-panel ports (three dual-stack)
• Six additional ports (via three headers)
memory
• Intel® Fast Memory Access
• Intel® Graphics Media Accelerator X3100 with
Intel® Clear Video Technology
• DVI-D and VGA integrated graphics—
DQ35JO only
Intel® I/O Controller Hub
• Supports two Ultra ATA 100 / 66 devices
• Six SATA (3.0 Gb/s) ports with port multiplier,
including one eSATA port
• Intel® PRO 10 / 100 / 1000 network connection
USB 2.0
Integrated Intel® ICH9DO controllers:
• Six back-panel ports (three dual-stack)
• Six additional ports (via three headers)
System BIOS
• 32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
Intel® Rapid BIOS Boot
• Intel® Rapid BIOS Boot
• Intel® Express BIOS Update support
• 32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
Intel® Rapid BIOS Boot
• Intel® Rapid BIOS Boot
• Intel® Express BIOS Update support
System Memory
Memory Capacity
• Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
Memory Types
• DDR2 800 / 667 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
• 1.8V
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
High-performance Intel® 82566DM
• Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
Memory Types
• DDR2 800 / 667 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
• 1.8V
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
High-performance Intel® 82566DM
Gigabit Ethernet
• High quality and reliability with Intel’s world-
class manufacturing and validation
• Supports Intel® vPro™ Processor Technology
based software and applications added
security and manageability
• High quality and reliability with Intel’s world-
class manufacturing and validation
• Supports Intel® vPro™ Processor Technology
based software and applications added
security and manageability
Expansion Capabilities
• One PCI bus add-in card connector
• Two PCI Express* x1 bus add-in card connectors
• One PCI Express* x16 graphics connector
• Two IEEE 1394a ports (1 external port,
1 internal header)—DQ35JO only
Audio
• One PCI bus add-in card connector
• Two PCI Express* x1 bus add-in card connectors
• One PCI Express* x16 graphics connector
• Two IEEE 1394a ports (1 external port,
1 internal header)—DQ35JO only
Audio
• 2+2 channel Intel® HD audio codec
Jumpers and Front-Panel Connectors
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Three front-panel Hi-Speed USB 2.0 headers
• One 1394a header—DQ35JO only
• Front-panel audio header
• One serial header
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Three front-panel Hi-Speed USB 2.0 headers
• One 1394a header—DQ35JO only
• Front-panel audio header
• One serial header
Mechanical
Board Style
• MicroATX 2.2-compliant
Board Size
• 9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard Power Requirements
• ATX12V
• MicroATX 2.2-compliant
Board Size
• 9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard Power Requirements
• ATX12V
Environment
Operating Temperature
• 0° C to +55° C
Storage Temperature
• -40° C to +70° C
• 0° C to +55° C
Storage Temperature
• -40° C to +70° C
Regulations and Safety Standards
United States and Canada
CSA/UL 60950-1, First Edition
(Binational Standard)
CSA/UL 60950-1, First Edition
(Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
IEC 60950-1:2001, First Edition
EMC Regulations
IEC 60950-1:2001, First Edition
EMC Regulations
(tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
EN 55022:2006 Class B
EN 55022:2006 Class B
Japan
VCCI V-3/04.04, V-4/03.04, Class B
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
KN-22:2005 and KN-24:2005
KN-22:2005 and KN-24:2005
Taiwan
CNS 13438:2006 Class B
CNS 13438:2006 Class B
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
China RoHS (MII Order # 39)
Lead-Free: The symbol is used
to identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in
to identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in
any of the raw materials and the end product is
not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.
not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.