Техническая Спецификация для STMicroelectronics ST232EBDR Linear IC ST232EBDR
Модели
ST232EBDR
Package information
ST202EB, ST202EC, ST232EB, ST232EC
10/18
DocID6900 Rev 17
6 Package
information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
ECOPACK
®
is an ST trademark.
6.1 Package
thermal characteristics
Table 9. Thermal characteristics
Package
Symbol
Value
Board type
Unit
SO16
Θ
JA
(1)
1. Θ
JA
is the package junction-to-ambient thermal resistance in
° C/W
115
1-layer board
°C/W
80
4-layer board
Θ
JC
(2)
2. Θ
JC
is the package junction-to-case thermal resistance in
° C/W
30
1-layer board
SO16L
Θ
JA
95
1-layer board
Θ
JC
30
1-layer board
TSSOP16
Θ
JA
140
1-layer board
95
2-layer board
Θ
JC
25
2-layer board