Техническая Спецификация для Texas Instruments TPS53319 Evaluation Module TPS53319EVM-136 TPS53319EVM-136
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TPS53319EVM-136
EVM Assembly Drawing and PCB Layout
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EVM Assembly Drawing and PCB Layout
The following figures (
through
) show the design of the TPS53319EVM-136 printed
circuit board. The EVM has been designed using a 6 Layer, 2 oz copper circuit board.
Figure 19. TPS53319EVM-136 Top Layer Assembly Drawing
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High Efficiency 14A Synchronous Buck Converter with Eco-Mode™
SLVU728 – May 2012
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