Техническая Спецификация для Texas Instruments Evaluation Module for BQ25060 1A, Single-Input, Single Cell Li-Ion Battery Charger with 50mA LDO BQ250 BQ25060EVM
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BQ25060EVM
PCB Layout Guideline
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Trim R2 CCW until V(J3(TS)) = 0.5 V ±50 mV.
Observe
→
D1 (/CHG) on.
4.3.2
For HPA577-002 (bq25060 EVM) only:
Slowly trim R7 until V(J3(TS)) = 1.30 V ±50 mV
Observe
→
D1 (/CHG) off. This indicates a temperature fault that was tripped by the cold
temperature threshold comparator
temperature threshold comparator
Trim R7 until V(J3(TS)) = 1 V ±50 mV.
Observe
→
D1 (/CHG) on.
Continue to trim R7 CW until V(J3(TS)) = 0.550 V ±50 mV
Observe
→
D1 (/CHG) off. This indicates a temperature fault that was tripped by the hot
temperature threshold comparator.
temperature threshold comparator.
Trim R7 CCW until V(J3(TS)) = 1 V ± 50 mV.
Observe
→
D1 (/CHG) on.
5
PCB Layout Guideline
It is important to pay special attention to the printed-circuit board (PCB) layout. The following provides
some guidelines:
some guidelines:
1. To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output
filter capacitors from OUT to GND (thermal pad) must be placed as close as possible to the
bq25050/60, with short trace runs to both IN, OUT, and GND (thermal pad).
bq25050/60, with short trace runs to both IN, OUT, and GND (thermal pad).
2. All low-current GND connections must be kept separate from the high-current charge or discharge
paths from the battery. Use a single-point ground technique incorporating both the small signal ground
path and the power ground path.
path and the power ground path.
3. The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the
maximum charge current in order to avoid voltage drops in these traces.
4. The bq25050/60 is packaged in a thermally enhanced SON package. The package includes a thermal
pad to provide an effective thermal contact between the IC and the PCB; this thermal pad is also the
main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full
PCB design guidelines for this package are provided in the application report entitled: QFN/SON PCB
Attachment Application Note (
main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full
PCB design guidelines for this package are provided in the application report entitled: QFN/SON PCB
Attachment Application Note (
).
8
bq25050/bq25060EVM
SLUU438 – July 2010
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