Техническая Спецификация для Texas Instruments IC MCU 16B MSP430F2111IRGET VQFN-24 TID MSP430F2111IRGET
Модели
MSP430F2111IRGET
6 MHz
12 MHz
16 MHz
1.8 V
2.2 V
2.7 V
3.3 V
3.6 V
Supply Voltage − V
S
y
s
te
m
F
re
q
u
e
n
c
y
−
M
H
z
Supply voltage range
during flash memory
programming
during flash memory
programming
Supply voltage range
during program execution
during program execution
Legend :
MSP430F21x1
SLAS439F
–
SEPTEMBER 2004
–
REVISED AUGUST 2011
Absolute Maximum Ratings
(1)
Voltage applied at V
CC
to V
SS
-0.3 V to 4.1 V
Voltage applied to any pin
(2)
-0.3 V to (V
CC
+ 0.3 V)
Diode current at any device terminal
±
2 mA
Unprogrammed device
-55
°
C to 150
°
C
Storage temperature, T
stg
(3)
Programmed device
-55
°
C to 150
°
C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
(3)
Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
(1)
MIN
NOM
MAX
UNIT
During program execution
1.8
3.6
V
CC
Supply voltage, AV
CC
= DV
CC
= V
CC
V
During flash memory programming
2.2
3.6
V
SS
Supply voltage, AV
SS
= DV
SS
= V
SS
0
V
I version
-40
85
T
A
Operating free-air temperature
°
C
T version
-40
105
V
CC
= 1.8 V, Duty cycle = 50%
±
10%
0
6
Processor frequency (maximum MCLK
f
SYSTEM
frequency)
(2) (1)
V
CC
= 2.7 V, Duty cycle = 50%
±
10%
0
12
MHz
(see
V
CC
≥
3.3 V, Duty cycle = 50%
±
10%
0
16
(1)
Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
(2)
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
specified maximum frequency.
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
CC
of 2.2 V.
Figure 1. Operating Area
14
Copyright
©
2004
–
2011, Texas Instruments Incorporated