Техническая Спецификация для Freescale Semiconductor Evaluation Board for MPC5500 Series MPC5554EVBE MPC5554EVBE

Freescale Semiconductor

5

The shaded rows in the following table indicate information specific to a four-layer board.

28

Maximum solder temperature 

11

Lead free (Pb-free)
Leaded (SnPb)

T

SDR

—
—

260.0
245.0

o

C

29

Moisture sensitivity level 

12

MSL

—

3

1

Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only, 
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability 
or cause permanent damage to the device.

2

1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 

o

C.

3

All functional non-supply I/O pins are clamped to V

SS

 and V

DDE

, or V

DDEH

.

4

AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of 
60 hours over the complete lifetime of the device (injection current not limited for this duration).

5

Internal structures hold the voltage greater than  –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC 
voltage greater than –0.6 V on eTPUB[15] and SINB during the internal power-on reset (POR) state.

6

Internal structures hold the input voltage less than the maximum voltage on all pads powered by V

DDEH

 supplies, if the 

maximum injection current specification is met (2 mA for all pins) and V

DDEH

 is within the operating voltage specifications.

7

Internal structures hold the input voltage less than the maximum voltage on all pads powered by V

DDE

 supplies, if the maximum 

injection current specification is met (2 mA for all pins) and V

DDE

 is within the operating voltage specifications.

8

Total injection current for all pins (including both digital and analog) must not exceed 25 mA.

9

Total injection current for all analog input pins must not exceed 15 mA.

10

Lifetime operation at these specification limits is not guaranteed.

11

Moisture sensitivity profile per IPC/JEDEC J-STD-020D.

12

Moisture sensitivity per JEDEC test method A112.

1

Junction to ambient 

1, 2

, natural convection (one-layer board)

1

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) 
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal 
resistance.

2

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

R

JA

24

°C/W

2

Junction to ambient 

1, 3

, natural convection (four-layer board 2s2p)

3

Per JEDEC JESD51-6 with the board horizontal.

R

JA

18

°C/W

3

Junction to ambient 

 (@200 ft./min., one-layer board)

R

JMA

19

°C/W

4

Junction to ambient 

 (@200 ft./min., four-layer board 2s2p)

R

JMA

15

°C/W

5

Junction to board 

4

 (four-layer board 2s2p)

4

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on 
the top surface of the board near the package.

R

JB

9

°C/W

6

Junction to case 

5

5

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method 
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

R

JC

5

°C/W

7

Junction to package top 

6

, natural convection

6

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature 
per JEDEC JESD51-2.



JT

2

°C/W