Техническая Спецификация для Freescale Semiconductor Tower System Eval Kit for MC9S12GN32 TWR-S12GN32-KIT TWR-S12GN32-KIT

Freescale Semiconductor

1201

This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST, and supply pins.

1

The values for thermal resistance are achieved by package simulations

2

Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.J

3

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4

.Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8.  Board temperature is measured in
simulation on the top surface of the board near the package.

5

Thermal resistance between the die and the case top surface as measured in simulation by the cold plate method (MIL SPEC-883
Method 1012.1).

6

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
JEDEC JESD51-2.

Ψ

JT

 is a useful value to use to estimate junction temperature in a steady state customer enviroment.

°C To +150°C)

Conditions are 3.15 V < V

DD35

< 3.6 V junction temperature from –40

°C to +150°C, unless otherwise noted

I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.

1

P Input high voltage

V

IH

0.65*V

DD35

—

—

V

2

T Input high voltage

V

IH

—

—

V

DD35

+0.3

V

3

P Input low voltage

V

IL

—

—

0.35*V

DD35

V

4

T Input low voltage

V

IL

V

SS35

 – 0.3

—

—

V

5

C Input hysteresis

V

HYS

0.06*V

DD35

—

0.3*V

DD35

mV

6

P

Input leakage current (pins in high impedance input
mode)

1

 Vin = VDD35 or VSS35

+125

°C to < T

J

 < 150

°C

+105

°C to < T

J

 < 125

°

–40

°C to < T

J

 < 105

°C

1

Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8

°C to 12 C° in the temperature range from 50°C to 125°C.

I

in

-1

-0.5
-0.4

—
—
—

1

0.5
0.4

µA

7

P Output high voltage (pins in output mode)

IOH = –1.75 mA

V

OH

V

DD35

-0.4

—

—

V

8

C Output low voltage (pins in output mode)

IOL = +1.75 mA

V

OL

—

—

0.4

V

9

P Internal pull up device current

V

IH

 min > input voltage > V

IL

 max

I

PUL

-1

—

 –70

µA

10

P Internal pull down device current

V

IH

 min > input voltage > V

IL

 max

I

PDH

1

—

70

µA

11

D Input capacitance

C

in

—

7

—

pF

12

T Injection current

2

Single pin limit
Total device limit, sum of all injected currents

2

Refer to

 for more details

I

ICS

I

ICP

–2.5

–25

—

2.5

25

mA