Техническая Спецификация для Infineon Technologies KITXMC2GOXMC1100V1TOBO1
XMC1100
XMC1000 Family
Electrical Parameter
Data Sheet
28
V1.4, 2014-05
Maximum current into
V
DDP
(TSSOP28/16,
VQFN24)
I
MVDD1
SR
–
130
mA
Maximum current into
V
DDP
(TSSOP38,
VQFN40)
I
MVDD2
SR
–
260
mA
Maximum current out of
V
SS
(TSSOP28/16,
VQFN24)
I
MVSS1
SR
–
130
mA
Maximum current out of
V
SS
(TSSOP38,
VQFN40)
I
MVSS2
SR
–
260
mA
1) Not subject to production test, verified by design/characterization. Hysteresis is implemented to avoid meta
stable states and switching due to internal ground bounce. It cannot be guaranteed that it suppresses
switching due to external system noise.
switching due to external system noise.
2) An additional error current (
I
INJ
) will flow if an overload current flows through an adjacent pin.
3) Not subject to production test, verified by design/characterization.
4) Not subject to production test, verified by design/characterization. However, for applications with strict low
power-down current requirements, it is mandatory that no active voltage source is supplied at any GPIO pin
when
when
V
DDP
is powered off.
Table 11
Input/Output Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Limit Values
Unit
Test Conditions
Min.
Max.
Subject to Agreement on the Use of Product Information