Техническая Спецификация для Atmel ARM-Based Evaluation Kit for SAM4S16C, 32-Bit ARM® Cortex® Microcontroller ATSAM4S-WPIR-RD ATSAM4S-WPIR-RD
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Модели
ATSAM4S-WPIR-RD
SAM4S Series [DATASHEET]
Atmel-11100G-ATARM-SAM4S-Datasheet_27-May-14
1186
Figure 45-3.
100-ball VFBGA Package Drawing
Table 45-7.
VFBGA Package Dimensions
Symbol
Common Dimensions (mm)
Package:
VFBGA
Body Size:
X
E
7.000 ± 0.100
Y
D
7.000 ± 0.100
Ball Pitch:
X
eE
0.650
Y
eD
0.650
Total Thickness:
A
1.000 max
Mold Thickness:
M
0.450 ref.
Substrate Thickness:
S
0.210 ref.
Ball Diameter:
0.300