Техническая Спецификация для Quickcool Radio modules KEYFOB-MF1K-02PVC-WHEP

MF1S50YYX

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2011. All rights reserved.

Quick reference data — The Quick reference data is an extract of the 
product data given in the Limiting values and Characteristics sections of this 
document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly 
states that this specific NXP Semiconductors product is automotive qualified, 
the product is not suitable for automotive use. It is neither qualified nor tested 
in accordance with automotive testing or application requirements. NXP 
Semiconductors accepts no liability for inclusion and/or use of 
non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in 
automotive applications to automotive specifications and standards, customer 
(a) shall use the product without NXP Semiconductors’ warranty of the 
product for such automotive applications, use and specifications, and (b) 
whenever customer uses the product for automotive applications beyond 
NXP Semiconductors’ specifications such use shall be solely at customer’s 
own risk, and (c) customer fully indemnifies NXP Semiconductors for any 
liability, damages or failed product claims resulting from customer design and 
use of the product for automotive applications beyond NXP Semiconductors’ 
standard warranty and NXP Semiconductors’ product specifications.

Bare die — All die are tested on compliance with their related technical 
specifications as stated in this data sheet up to the point of wafer sawing and 
are handled in accordance with the NXP Semiconductors storage and 
transportation conditions. If there are data sheet limits not guaranteed, these 
will be separately indicated in the data sheet. There are no post-packing tests 
performed on individual die or wafers.

NXP Semiconductors has no control of third party procedures in the sawing, 
handling, packing or assembly of the die. Accordingly, NXP Semiconductors 
assumes no liability for device functionality or performance of the die or 
systems after third party sawing, handling, packing or assembly of the die. It 
is the responsibility of the customer to test and qualify their application in 
which the die is used.

All die sales are conditioned upon and subject to the customer entering into a 
written die sale agreement with NXP Semiconductors through its legal 
department.

Notice: All referenced brands, product names, service names and trademarks 
are the property of their respective owners.

MIFARE  — is a trademark of NXP B.V.

For more information, please visit: 

For sales office addresses, please send an email to: