Техническая Спецификация для Quickcool Radio modules KEYFOB-MF1K-03ABS-BU

Модели
KEYFOB-MF1K-03ABS-BU
Скачать
Страница из 39
MF1S50YYX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196330 
3 of 39
NXP Semiconductors
MF1S50yyX
MIFARE Classic 1K - Mainstream contactless smart card IC
5. Ordering 
information
 
6. Block 
diagram
 
Table 2.
Ordering information
Type number
Package
Name
Description
Version
MF1S5001XDUD
FFC Bump
8 inch wafer, 120 
μm thickness, on film frame carrier, electronic fail die 
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5001XDUF
FFC Bump
8 inch wafer, 75 
μm thickness, on film frame carrier, electronic fail die 
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5000XDA4
MOA4
plastic leadless module carrier package; 35 mm wide tape, 7-byte UID
SOT500-2
MF1S5000XDA8
MOA8
plastic leadless module carrier package; 35 mm wide tape, 7-byte UID
SOT500-4
MF1S5031XDUD
FFC Bump
8 inch wafer, 120 
μm thickness, on film frame carrier, electronic fail die 
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5031XDUF
FFC Bump
8 inch wafer, 75 
μm thickness, on film frame carrier, electronic fail die 
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5030XDA4
MOA4
plastic leadless module carrier package; 35 mm wide tape, 
4-byte non-unique ID
SOT500-2
MF1S5030XDA8
MOA8
plastic leadless module carrier package; 35 mm wide tape, 
4-byte non-unique ID
SOT500-4
Fig 2.
Block diagram of MF1S50yyX
001aan006
RF
INTERFACE
UART
ISO/IEC 14443
TYPE A
LOGIC UNIT
RNG
CRC
EEPROM
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR