Техническая Спецификация для Kingston Laptop RAM () DDR3L RAM 204-pin SO-DIMM HX316LS9IB/8
Модели
HX316LS9IB/8
DESCRIPTION
HyperX HX316LS9IB/8 is a 1G x 64-bit (8GB) DDR3L-1600 CL9
SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory
module, based on sixteen 512M x 8-bit DDR3 FBGA compo-
nents. This module has been tested to run at DDR3L-1600 at a
low latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing
parameters are shown in the PnP Timing Parameters section
below. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
Document No. 4807048-001.A00 05/20/14 Page 1
SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin)
48.125ns (min.)
Refresh to Active/Refresh
260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
33.75ns (min.)
Maximum Operating Power
TBD W* @1.35V
UL Rating
94 V - 0
Operating Temperature
0
o
C to 85
o
C
Storage Temperature
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
HX316LS9IB/8
8GB 1G x 64-Bit DDR3L-1600
CL9 204-Pin SODIMM
CL9 204-Pin SODIMM
Continued >>
kingston.com/hyperx
PnP JEDEC TIMING PARAMETERS:
•
DDR3-1600 CL9-9-9 @1.35V or 1.5V
•
DDR3-1333 CL8-8-8 @1.35V or 1.5V
•
DDR3-1066 CL6-6-6 @1.35V or 1.5V
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
HX318C10FB/4
FEATURES
•
JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
•
VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
•
800MHz fCK for 1600Mb/sec/pin
•
8 independent internal bank
•
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
•
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•
8-bit pre-fetch
•
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•
Bi-directional Differential Data Strobe
•
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•
On Die Termination using ODT pin
•
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
•
Asynchronous Reset
•
PCB : Height 1.180” (30.00mm), double sided component