Техническая Спецификация для Intel 4 620 JM80547PG0722MM

26

I

TT

FSB termination current

—

—

3.5

A

I

CC_VCCA

I

CC 

for PLL lands

—

—

120

mA

I

CC_VCCIOPLL

I

CC

 for I/O PLL land

—

—

100

mA

I

CC_GTLREF

I

CC

 for GTLREF

—

—

200

μA

1.

Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be up-
dated with characterized data from silicon measurements at a later date.

2.

Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can not be altered. Indi-
vidual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within
the VID range. Note that this differs from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced
Intel SpeedStep Technology, or Enhanced Halt State). 

3.

These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is required. See 

and 

 for more information.

4.

The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz bandwidth os-
cilloscope, 1.5 pF maximum probe capacitance, and 1 M

Ω minimum impedance. The maximum length of ground wire on the probe should be less

than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

5.

Refer to 

 and 

 for the minimum, typical, and maximum V

CC

 allowed for a given current. The processor should not be subjected

to any V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

cc_max

 for a given current.

6.

775_VR_CONFIG_04A and 775_VR_CONFIG_04B refers to voltage regulator configurations that are defined in the Voltage Regulator Down
(VRD) 10.1 Design Guide for Desktop LGA775 Socket.

7.

Adherence to this loadline specification for the processor is required to ensure reliable processor operation.

8.

Refer to 

 and 

 for the minimum, typical, and maximum V

CC

 allowed for a given current. The processor should not be subjected

to any V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_max

 for a given current.

9.

These frequencies will operate in a system designed for 775_VR_CONFIG_04B processors. The power and I

CC

 will be incrementally higher in

this configuration due to the improved loadline and resulting higher V

CC

.

10.

I

cc_max

 is specified at V

CC_max

.

11.

The current specified is also for AutoHALT State.

12.

I

CC

 Stop-Grant and I

CC

 Auto Halt are specified at V

CC_max

.

13.

These parameters are based on design characterization and are not tested.

14.

The maximum instantaneous current the processor will draw while the thermal control circuit is active as indicated by the assertion of PROCHOT#
is the same as the maximum I

CC

 for the processor.

15.

V

TT

 must be provided via a separate voltage source and not be connected to V

CC

. This specification is measured at the land.

16.

Baseboard bandwidth is limited to 20 MHz.

17.

This is maximum total current drawn from V

TT

 plane by only the processor. This specification does not include the current coming from R

TT

(through the signal line). Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket to determine the total I

TT

drawn by the system. Contact your Intel representative for further details and documentation.