Техническая Спецификация для Intel 4 519K HH80547PE0831MN

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Datasheet
69
Thermal Specifications and Design Considerations
5.2.4
THERMTRIP# Signal Pin
Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic 
cooling failure, the processor will automatically shut down when the silicon has reached an 
elevated temperature (refer to the THERMTRIP# definition in 
). At this point, the FSB 
signal THERMTRIP# will go active and stay active as described in 
. THERMTRIP# 
activation is independent of processor activity and does not generate any bus cycles. If 
THERMTRIP# is asserted, processor core voltage (V
CC
) must be removed.
5.2.5
T
control
 and Fan Speed Reduction
T
control
 is a temperature specification based on a temperature reading from the thermal diode. The 
value for T
control
 will be calibrated in manufacturing and configured for each processor. The 
T
control
 temperature for a given processor can be obtained by reading the 
IA32_TEMPERATURE_TARGET MSR in the processor. The T
control
 value that is read from the 
IA32_TEMPERATURE_TARGET MSR needs to be converted from Hexadecimal to Decimal and 
added to a base value of 50 °C.
The value of T
control
 may vary from 00h to 1Eh (0 to 30 °C).
When T
diode
 is above T
control
, then T
c
 must be at or below T
c(max)
 as defined by the thermal profile 
in 
; otherwise, the processor temperature can be maintained at T
control
 (or 
lower) as measured by the thermal diode.
The purpose of this feature is to support acoustic optimization through fan speed control.
5.2.6
Thermal Diode
The processor incorporates an on-die thermal diode. A thermal sensor located on the system board 
may monitor the die temperature of the processor for thermal management/long term die 
temperature change purposes. 
 provide the diode parameter and interface 
specifications. This thermal diode is separate from the Thermal Monitor’s thermal sensor and 
cannot be used to predict the behavior of the Thermal Monitor.