Техническая Спецификация для Intel 4 519K HH80547PE0831MN
Модели
HH80547PE0831MN
Datasheet
69
Thermal Specifications and Design Considerations
5.2.4
THERMTRIP# Signal Pin
Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic
cooling failure, the processor will automatically shut down when the silicon has reached an
elevated temperature (refer to the THERMTRIP# definition in
cooling failure, the processor will automatically shut down when the silicon has reached an
elevated temperature (refer to the THERMTRIP# definition in
). At this point, the FSB
signal THERMTRIP# will go active and stay active as described in
. THERMTRIP#
activation is independent of processor activity and does not generate any bus cycles. If
THERMTRIP# is asserted, processor core voltage (V
THERMTRIP# is asserted, processor core voltage (V
CC
) must be removed.
5.2.5
T
control
and Fan Speed Reduction
T
control
is a temperature specification based on a temperature reading from the thermal diode. The
value for T
control
will be calibrated in manufacturing and configured for each processor. The
T
control
temperature for a given processor can be obtained by reading the
IA32_TEMPERATURE_TARGET MSR in the processor. The T
control
value that is read from the
IA32_TEMPERATURE_TARGET MSR needs to be converted from Hexadecimal to Decimal and
added to a base value of 50 °C.
added to a base value of 50 °C.
The value of T
control
may vary from 00h to 1Eh (0 to 30 °C).
When T
diode
is above T
control
, then T
c
must be at or below T
c(max)
as defined by the thermal profile
in
; otherwise, the processor temperature can be maintained at T
control
(or
lower) as measured by the thermal diode.
The purpose of this feature is to support acoustic optimization through fan speed control.
5.2.6
Thermal Diode
The processor incorporates an on-die thermal diode. A thermal sensor located on the system board
may monitor the die temperature of the processor for thermal management/long term die
temperature change purposes.
may monitor the die temperature of the processor for thermal management/long term die
temperature change purposes.
provide the diode parameter and interface
specifications. This thermal diode is separate from the Thermal Monitor’s thermal sensor and
cannot be used to predict the behavior of the Thermal Monitor.
cannot be used to predict the behavior of the Thermal Monitor.