Техническая Спецификация для Intel 4 662 HH80547PG1042MH
Модели
HH80547PG1042MH
Datasheet
13
Introduction
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
•
Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package—
Processor in the FC-LGA4 package with a 2-MB L2 cache.
Processor in the FC-LGA4 package with a 2-MB L2 cache.
•
Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package— Processor
in the FC-LGA4 package with a 2-MB L2 cache.
in the FC-LGA4 package with a 2-MB L2 cache.
•
Processor — For this document, the term processor refers to the Pentium 4 processor 6xx
sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme
Edition on 90 nm process in the 775-land package.
sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme
Edition on 90 nm process in the 775-land package.
•
Keep-out zone — The area on or near the processor that system design can not use.
•
Intel
®
925X/925XE Express chipset — Chipsets that supports DDR2 memory technology for
the Pentium 4 processor in the 775-land package.
•
Intel
®
915G/915GV/915GL and 915P/915PL Express chipset — Chipsets that supports
DDR/DDR2 memory technology for the Pentium 4 processor in the 775-land package.
•
Intel
®
945G/945P Express chipset — Chipsets that supports DDR2 memory technology for
the Pentium 4 processor in the 775-land package.
•
Intel
®
955X Express chipset — Chipsets that supports DDR2 memory technology for the
Pentium 4 processor in the 775-land package.
•
Processor core — Processor core die with integrated L2 cache.
•
FC-LGA4 package — The Pentium 4 processor is available in a Flip-Chip Land Grid Array 4
package, consisting of a processor core mounted on a substrate with an integrated heat
spreader (IHS).
package, consisting of a processor core mounted on a substrate with an integrated heat
spreader (IHS).
•
LGA775 socket — The Pentium 4 processor mates with the system board through a surface
mount, 775-land, LGA socket.
mount, 775-land, LGA socket.
•
Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
•
Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
•
Storage conditions—Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
•
Functional operation—Refers to normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.