Техническая Спецификация для Intel 4 662 HH80547PG1042MH
Модели
HH80547PG1042MH
Datasheet
35
Package Mechanical Specifications
3
Package Mechanical
Specifications
Specifications
The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a processor core
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions,
such as a heatsink.
interfaces with the motherboard via an LGA775 socket. The package consists of a processor core
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions,
such as a heatsink.
shows a sketch of the processor package components and how they
are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details
on the LGA775 socket.
on the LGA775 socket.
The package components shown in
include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in
include dimensions necessary to design a thermal solution for the processor. These dimensions
include:
include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in].
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in].
Note:
Guidelines on potential IHS flatness variation with socket load plate actuation and installation of
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
Figure 3-1. Processor Package Assembly Sketch
System Board
LGA775 Socket
Capacitors
TIM
Core (die)
IHS
Substrate