Техническая Спецификация для Intel E3-1105C AV8062701048800

Intel

®

 Xeon

®

 and Intel

®

 Core™ Processors For Communications Infrastructure

Datasheet - Volume 1 of 2

May 2012

146

Document Number: 327405

-

001

The following section contains the mechanical drawings for the processor. The 

processor utilizes a 37.5 x 37.5 mm, FC-BGA package. There are two versions of die 

available on this package — a 4-Core-die version and a 2-Core-die version. The 

processor SKUs and their corresponding die-type are provided in 

The primary mechanical difference between the two products is the size of the die on 

the substrate. The pinout, package substrate and solder ball pattern are the same 

between the two packages. 

See the following package drawings for the die size of the two processor packages. 

 shows the 4-Core Die Mechanical Package and 

Figure 10-6

 shows the 2-

Core Die / 1-Core Die Mechanical Package. The dimensions in the figures are in 

millimeters. 

Remember to check the size differences between the two dies when designing your 

thermal solution.