Техническая Спецификация для Intel E3-1105C AV8062701048800
Модели
AV8062701048800
Product Overview
Intel
®
Xeon
®
and Intel
®
Core™ Processors For Communications Infrastructure
May 2012
Datasheet - Volume 1 of 2
Document Number: 327405
-
001
17
2.1
Product Features
2.2
Processor Details
• Four, two or single execution cores (4C, 2C or 1C respectively)
• 32-KB data first-level cache (L1) for each core, parity protected
• 32-KB instruction first-level cache (L1) for each core, ECC protected
• 256-KB shared instruction/data second-level cache (L2) for each core, ECC
• 32-KB data first-level cache (L1) for each core, parity protected
• 32-KB instruction first-level cache (L1) for each core, ECC protected
• 256-KB shared instruction/data second-level cache (L2) for each core, ECC
protected
• Up to 8-MB shared instruction/data third-level cache (L3) across all cores, ECC
protected
2.3
Supported Technologies
• Intel
®
Virtualization Technology for Directed I/O (Intel
®
VT-d)
• Intel
®
Virtualization Technology (Intel
®
VT-x)
• Intel
®
Streaming SIMD Extensions 4.1 (Intel
®
SSE4.1)
• Intel
®
Streaming SIMD Extensions 4.2 (Intel
®
SSE4.2)
• Intel
®
Hyper-Threading Technology
• Intel
®
64 Architecture
• Execute Disable Bit
• Intel
• Intel
®
Advanced Vector Extensions (Intel
®
AVX)
• Advanced Encryption Standard New Instructions (AES-NI)
• PCLMULQDQ Instruction
• PCLMULQDQ Instruction
2.4
Interface Features
2.4.1
System Memory Support
• One or two channels of DDR3 memory with a maximum of two UDIMMs or two SO-
DIMMs per channel
• ECC Memory Down topology of up to eighteen x8 SDRAM Devices per channel
• Non-ECC Memory Down topology of up to eight x16 DDR3 SDRAM Devices per
• Non-ECC Memory Down topology of up to eight x16 DDR3 SDRAM Devices per
channel
• Single- and dual-channel memory organization modes
• Memory capacity supported from 512 MB up to 32 GB
• Using 4-Gb device technologies, the largest total memory capacity possible is 32
• Memory capacity supported from 512 MB up to 32 GB
• Using 4-Gb device technologies, the largest total memory capacity possible is 32
GB, assuming Dual Channel Mode with four x8, double-sided, dual ranked
unbuffered DIMM memory configuration
• 1-Gb, 2-Gb and 4-Gb DDR3 DRAM technologies are supported for x8 and x16
devices
— Using 4Gb device technology, the largest memory capacity possible is 16 GB,
assuming dual-channel mode with two x8, dual-ranked, un-buffered, DIMM
memory configuration.
• Data burst length of eight for all memory organization modes
• Memory DDR3 data transfer rates of 1066 MT/s, 1333 MT/s and 1600 MT/s
• Memory DDR3 data transfer rates of 1066 MT/s, 1333 MT/s and 1600 MT/s