Справочник Пользователя для ELANsat Tech OTP ROM EM78P156N

 

Test category 

Test conditions 

Remarks 

Solderability 

Solder temperature=245

±5℃，for 5 seconds up to the stopper 

using a rosin-type flux 

 

Step1: TCT ，65℃(15mins)~150℃(15mins)，10 cycles 

Step2: bake 125℃，TD(durance)=24 hrs 

Step3:soak 30

°C /60%，TD(durance)=192hrs 

Pre-condition 

Step4:IR flow 3cycles  

(Pkg thickness≧2.5mm or Pkg volume≧350mm

3

 ----225

±5℃) 

(Pkg thickness≦2.5mm or Pkg volume≦350mm

3

 ----240

±5

℃ ) 

For SMD IC(such as 
SOP、QFP、SOJ…etc)

Temperature cycle test -65℃(15mins)~150℃(15mins) , 200 cycles 

 

Pressure cooker test  T

A 

=121℃,RH=100%,pressure=2atm, TD(durance)= 96 Hrs 

 

High temperature /high 
humidity test 

TA=85℃ , RH=85%，TD(durance)=168 ,500 Hrs 

 

High-temperature 
storage life 

TA=150℃, TD(durance)=500,1000Hrs 

 

High-temperature 
operating life 

TA=125 ℃ , VCC=Max. operating voltage, TD(durance) 
=168,500,1000Hrs 

 

Latch-up 

TA=25℃, VCC=Max. operating voltage, 150mA/20V 

 

ESD(HBM) 

TA=25℃, ≧∣±3KV∣ 

ESD(MM) 

TA=25℃, ≧∣±300V∣ 

IP_ND,OP_ND,IO_ND

IP_NS,OP_NS,IO_NS

IP_PD,OP_PD,IO_PD,

IP_PS,OP_PS,IO_PS,

VDD-VSS(+),VDD_VSS

(-)mode 

 

 

This specification is subject to change without prior notice.     56            

07.29.2004 (V1.2)