Техническая Спецификация для GE mCOM10-L1500
GE
Intelligent Platforms
FEATURE
BENEFIT
Small form factor
• Size (84x55mm) makes the mCOM10-L1500 ideal for applications where compact size is critical
Rugged design with soldered components
• Reliable computing capabilities for applications needing higher immunity to shock and vibration
Next-generation multicore
AMD G-Series SOC
AMD G-Series SOC
• Delivers high performance coupled with low power consumption
• Supports multiple graphics displays
• Supports multiple graphics displays
Flexible options
• Shock and vibration protection
• Extended operating temperature range for environments with temperature extremes
• Conformal coating for protection against dust, moisture and chemicals
• Extended operating temperature range for environments with temperature extremes
• Conformal coating for protection against dust, moisture and chemicals
As billions of machines continue to
expand the Industrial Internet, they will
be performing more tasks at greater speed
and operating in harsh environments. At
the same time, computer processors will
continue to evolve.
expand the Industrial Internet, they will
be performing more tasks at greater speed
and operating in harsh environments. At
the same time, computer processors will
continue to evolve.
To remain competitive, GE Intelligent
Platforms understands that businesses
must proactively respond to these twin
forces of machine connectivity and
processor obsolescence.
Platforms understands that businesses
must proactively respond to these twin
forces of machine connectivity and
processor obsolescence.
To address these needs, GE developed
the mCOM10-L1500. This module takes
advantage of the flexibility in cost, perfor-
mance and power capabilities of the
latest generation AMD Embedded G-Series
System-on-Chip (SOC). And thanks to its
COM Express architecture, as chip tech-
nology evolves, the module can be replaced
without adverse effect on the underlying
hardware and assets.
the mCOM10-L1500. This module takes
advantage of the flexibility in cost, perfor-
mance and power capabilities of the
latest generation AMD Embedded G-Series
System-on-Chip (SOC). And thanks to its
COM Express architecture, as chip tech-
nology evolves, the module can be replaced
without adverse effect on the underlying
hardware and assets.
The mCOM10-L1500 is ideal for a variety
of commercial, industrial, transportation
and defense applications in a range of
embedded computing environments. This
durable COM Express solution reduces
overall design cycle and validation require-
ments to lower the total cost of ownership.
of commercial, industrial, transportation
and defense applications in a range of
embedded computing environments. This
durable COM Express solution reduces
overall design cycle and validation require-
ments to lower the total cost of ownership.
Best-in-class performance & reliability
GE’s mCOM10-L1500 COM Express module
is the miniature form-factor solution in our
COM Express portfolio, and offers the high-
level performance and ultimate durability
needed for applications that operate in
harsh environments. It is ideal for applica-
tions requiring a small form factor and
low power consumption on a type 10 COM
Express platform. As with all GE COM
Express modules, the mCOM10-L1500
fully uses the capabilities of the newest
generation of processors.
is the miniature form-factor solution in our
COM Express portfolio, and offers the high-
level performance and ultimate durability
needed for applications that operate in
harsh environments. It is ideal for applica-
tions requiring a small form factor and
low power consumption on a type 10 COM
Express platform. As with all GE COM
Express modules, the mCOM10-L1500
fully uses the capabilities of the newest
generation of processors.
On-board components are specifically
selected for their reliability in demanding
conditions. Unlike solutions designed for
benign environments, the processor and
memory are soldered to the board for
maximum resistance to shock and vibra-
tion. Extended mechanical construction
protects the module, which is designed
for optional conformal coating to provide
additional resistance to moisture, dust,
chemicals, and temperature extremes.
selected for their reliability in demanding
conditions. Unlike solutions designed for
benign environments, the processor and
memory are soldered to the board for
maximum resistance to shock and vibra-
tion. Extended mechanical construction
protects the module, which is designed
for optional conformal coating to provide
additional resistance to moisture, dust,
chemicals, and temperature extremes.
Longer lifecycles & lower product costs
The COM Express architecture extends
the useful life of the subsystem by allowing
a simple, cost-effective upgrade of the
processor alone. The long-term cost of
ownership is reduced while ensuring
that performance keeps pace with
changing needs.
the useful life of the subsystem by allowing
a simple, cost-effective upgrade of the
processor alone. The long-term cost of
ownership is reduced while ensuring
that performance keeps pace with
changing needs.
Commitment to customer satisfaction
Today’s organizations are operating lean,
engineering resources are scarce, and
time-to-market is critical. Therefore, GE
complements the performance and prac-
tical benefits of our COM Express modules
with world-class domain expertise and a
focus on exceptional customer service.
To help you get to market faster and lower
your development costs, we can assist
you with in-house carrier design, or build
a carrier specifically for you.
engineering resources are scarce, and
time-to-market is critical. Therefore, GE
complements the performance and prac-
tical benefits of our COM Express modules
with world-class domain expertise and a
focus on exceptional customer service.
To help you get to market faster and lower
your development costs, we can assist
you with in-house carrier design, or build
a carrier specifically for you.
mCOM10-L1500
Mini COM Express Module