Справочник Пользователя для Intel Xeon X3440 BX80605X3440

106

Thermal/Mechanical Specifications and Design Guidelines

8                    7                     6                     5

     4                     3                     2

H

G

F

E

D

C

B

A

8                    7                     6                     5

     4                     3                     2           

          1

H

G

F

E

D

C

B

A

A

A

E

D

C

C

B 2

B 1

C 1

C 2

J 2

H 2

J 1

6X RM

1

2X

M 1

2X

M 2

2X

M 3

F 2

F 4

D 1

G 1

H 1

G 2

C 4

C 3

0.021 SOLDER RESIST

 THIS DRAWING CONTAINS INTEL CORPORAT

ION CONFIDENTIAL INFORMATION. IT IS 

DISCLOSED IN CONFIDENCE AND ITS CONT

ENTS

 MAY NOT BE DISCLOSED, REPRODUCED, DI

SPLAYED OR MODIFIED, WITHOUT THE PRI

OR WRITTEN CONSENT OF INTEL CORPORAT

ION.

E22526

1

6

DWG. NO

SHT.

REV

DEPARTMENT

R

2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119

 TITLE

PACKAGE MECHANICAL DRAWING

SIZE

 DRAWING NUMBER

REV

A1

E22526

6

SCALE:

5

DO NOT SCALE DRAWING

SHEET

1

 OF 

2

FINISH

MATERIAL

DATE

APPROVED BY

DATE

CHECKED BY

DATE

DRAWN BY

DATE

DESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

ALL UNTOLERANCED LINEAR

DIMENSIONS ±

0

ANGLES ±

0.5

THIRD ANGLE PROJECTION

C

C

C

PIN #1

SEE DETAIL

A

B

SECTION

A-A

DETAIL

A

SCALE

100

DETAIL

B

SCALE

15

IHS SEALANT

0.203

C

0.08

0.203

C

0.05

IHS LID

PACKAGE

SUBSTRATE

DETAIL

C

SCALE

15

SUBSTRATE ALIGNMENT

FIDICAL

SYMBOL

MILLIMETERS

COMMENTS

MIN

MAX

B 1

37.45

37.55

B 2

37.45

37.55

C 1

31.72

31.92

1

C

E

C 2

33.9

34.1

1

C

D

C 3

1.3

1.4

C 4

2.2

2.3

D 1

0.625

F 2

4.112

4.602

F 4

2.331

2.843

G 1

35.6616 BASIC

0.15

C

D

E

G 2

35.6616 BASIC

H 1

17.8308 BASIC

H 2

17.8308 BASIC

J 1

0.9144 BASIC

J 2

0.9144 BASIC

SYMBOL

MILLIMETERS

COMMENTS

MIN

MAX

M 1

0.2

M 2

0.52

M 3

0.1

RM

1

0.13

0.175